At Standard Printed Circuits, we specialize in high-quality, American-made printed circuit boards that are built with precision, speed, and care. Whether you're developing the next RF breakthrough, a high-reliability aerospace system, or a time-sensitive prototype, we're here to make it happen.
We're not a massive corporation, and that's a good thing. Our small size means big advantages: fast communication, hands-on service, and a team that knows your name and understands your specs.
We stock a wide variety of bonding films from standard epoxy prepregs and other thermoset films to low Dk thermoplastic resins like DuPont’s FEP.
One of the biggest challenges in manufacturing edge-plated castellations is producing a clean, consistent plated surface after the PCB is profiled.
With the traditional plate-and-rout method, holes are drilled and copper plated before a router bit cuts through the plated holes to create the castellated board edge. While this process is widely used, the mechanical action of the router can create copper burrs, plating deformation, fiberglass breakout, and rough edges inside the castellated holes.
As the rotating router bit passes through a plated hole, it can pull or smear the relatively soft copper plating rather than producing a perfectly clean cut. The smaller the castellation and the tighter the tolerance, the more difficult it can be to maintain a clean, repeatable finished feature.
These concerns become increasingly important on RF and microwave modules, where castellations may provide signal, ground, power, and mechanical connections between the module and the primary PCB.
Standard Printed Circuits uses precision dicing saw technology as an alternative to conventional routing for demanding castellated PCB applications.
Instead of using the side of a rotating router bit to mechanically cut through the plated hole, the dicing saw uses a thin, precision-controlled blade to cut directly through the plated feature at a defined location.
This controlled cutting action helps minimize the copper pulling and deformation that can occur during traditional routing, producing a cleaner, straighter, and more repeatable exposed plated edge.
For small RF modules and other tight-tolerance designs, the ability to precisely control where the plated hole is cut can be particularly valuable.
Drilling and plating a castellation are only part of the manufacturing challenge. The quality of the finished feature ultimately depends on how accurately and cleanly the plated hole can be divided at the PCB edge.
Traditional plate-and-rout processing can leave burrs because the router is mechanically cutting sideways through the copper-plated hole.
Standard's dicing saw process provides another approach: precisely slicing through the plated feature to create a cleaner finished castellation with reduced burr formation and improved dimensional consistency.
Combined with Standard's experience manufacturing RF, microwave, PTFE, hybrid, and other high-frequency printed circuit boards, this capability provides customers with a specialized U.S. manufacturing solution for PCB designs requiring high-quality edge-plated castellations.
| Description | Production | Prototype | Experimental |
|---|---|---|---|
| Minimum Laminate Thickness | .003" | .002" | .0005" |
| Maximum Laminate Thickness | .250" | .250" | .265" |
| Maximum Layer Count | 14 | 24 | 24 |
| Minimum Conductor Width | .005" | .004" | .004" |
| Minimum Spacing | .005" | .005" | .004" |
| Minimum Annular Ring (PTH) | .005" | .005" | .004" |
| Description | Production | Prototype | Experimental |
|---|---|---|---|
| HALF OUNCE COPPER - Minimum Conductor Width | .005" | .005" | .003" |
| HALF OUNCE COPPER - Minimum Spacing | .005" | .005" | .004" |
| HALF OUNCE COPPER - Minimum Annular Ring (PTH) | .005" | .005" | .004" |
| Description | Production | Prototype | Experimental |
|---|---|---|---|
| Line Width Tolerance | +/- .001" | +/- .0005" | +/- .0004" |
| Front to Back Registration Tolerance | +/- .002" | +/- .001" | +/- .0005" |
| Max Copper Weight (with Solder Mask) | 3 ounce | ||
| Max Copper Weight (w/o Solder Mask) | 5 ounce | 7 ounce | |
| Etch Factor (per ounce of base copper) | 0.001" |
| Description | Production | Prototype | Experimental |
|---|---|---|---|
| Minimum SMT pitch | .020" | .015" | .012" |
| Minimum Annular Ring (signal layer) | .008" | .006" | .005" |
| Minimum Clearance Ring (pwr/grd) | .015" | .015" | .010" |
| Minimum Edge Clearance (routing) | .015" | .010" | .008" |
| Minimum Edge Clearance (scoring) | .030" | .025" | .020" |
| On Routed Panels we typically add | .500" waste area to all edges | ||
| Dimensional Accuracy (routing) | +/- .005" | +/- .003" | |
| Dimensional Accuracy (scoring) | +/- .020" | +/- .020" | |
| Minimum Score Thickness | +/- .015" | +/- .010" | |
| Minimum Size for Routed Slot | .020" | .020" | |
| Dicing | +/- .001" |
| Description | Production | Prototype | Experimental |
|---|---|---|---|
| Minimum Hole Size (PTH) | .008" | .007" | .006" |
| Drilled Hole Location Tolerance | +/- .003" | +/- .002" | +/- .002" |
| Max Aspect Ratio (Dt : hole dia) | 8:1 | 10:1 | 12:1 |
| Description | Production | Prototype | Experimental |
|---|---|---|---|
| Min Soldermask Annular Ring | .003" | ||
| Min LPI Feature | .004" | ||
| Min Line Width (silkscreen) | .005" | ||
| Min Character Height (silkscreen) | .050" |
| Description | Production | Prototype | Experimental |
|---|---|---|---|
| Copper in PTH | .001 - .0015" | ||
| Tin Lead (solder) | 60-100 micro inches | ||
| Electrolytic Nickel | 150-200 micro inches | ||
| Electrolytic Gold | 30-50 micro inches | ||
| Electrolytic Tin | 150-200 micro inches | ||
| Electroless Tin | 40 micro inches | ||
| Immersion Silver | 5-15 micro inches | ||
| Electroless Nickel | 118-236 micro inches (per IPC-4552 ENIG spec) | ||
| Immersion Gold | 1.97 (min) micro inches (per IPC-4552 ENIG spec) |
| Desired File Formats | NC Drill Files; AutoCAD (DWG or DXF); Gerber |
|---|---|
| Outside Processes Available | Laser Rout; Electrical Testing; Via Fill |
At SPC, we specialize in delivering high-reliability PCBs for demanding industries. Our team understands the unique needs of engineers in sectors where precision, performance, and partnership matter most.
From signal integrity to tight tolerances, we understand the challenges of high-frequency designs. Our boards are built to support your RF goals without compromise.
Accuracy starts at the board level. We partner with innovators who demand precision and repeatability, offering PCBs that match the rigor of scientific and industrial applications.
Speed, reliability, and scalability: your network depends on them. We build boards that keep communications flowing, from infrastructure to emerging 5G tech.
Tough environments demand tougher boards. With ITAR compliance and meticulous quality control (AS9100 Certified), we serve defense and aerospace clients with mission-critical reliability.
| General |
Prototype
Medium Volume Production |
Expedited Deliveries |
|---|---|---|
| Industry Focus |
Aerospace
Defense/Military Industrial Electronics Instrumentation |
Medical
Microwave/RF Telecommunications/IT |
| Industry Certifications |
AS9100 - Aerospace Quality Management Standard
ISO9001 - International Standards Organization ITAR - International Traffic in Arms Regulations RoHS - Restriction of Hazardous Substances |
PCB Industry Standards:
IPC-6012 - Qualification and Performance Specification for Rigid Printed Boards IPC-6018 - Microwave End Product Board Inspection and Test IPC-A-600 - Acceptability of Printed Boards UL -Underwriters Laboratories |