Printed Circuit Board Manufacturing

Standard Printed Circuits, Inc. is an independent manufacturer of rigid printed circuit boards up to 24 layers. Our expertise covers a broad range of advanced dielectrics including PTFE, ceramic loaded PTFE, TMM, Polyimide, Polyphenylene oxide, as well as the more common multi-functional FR4s and phenolic resin systems. We stock a wide variety of bonding films from standard epoxy prepregs and other thermoset films to low Dk thermoplastic resins like DuPont’s FEP.

Standard Printed Circuits utilizes several advanced systems to process our products including: Plasma etching, Sodium Etch of PTFE surfaces, Conductive Polymer line for PTH processing, Vacuum lamination, Flying Probe Electrical Tester, as well as a State-of-the-Art Chemcut 8000 Etcher for controlled impedance. In addition, we can provide a wide variety of final finishes including: SMOBC, HASL, as well as our RoHS compliant ‘lead free’ finishes: ENIG, Immersion Silver, Electroless Tin, Lead Free HASL, and Bare Copper with OSP.

DESCRIPTION PRODUCTION PROTOTYPE EXPERIMENTAL
Minimum Laminate Thickness .003" .002" .0005"
Maximum Laminate Thickness .250" .250" .265"
Maximum Layer Count 14 24 24
Minimum Conductor Width .005" .004" .004"
Minimum Spacing .005" .005" .004"
Minimum Annular Ring (PTH) .005" .005" .004"
HALF OUNCE COPPER
Minimum Conductor Width .005" .005" .003"
Minimum Spacing .005" .005" .004"
Minimum Annular Ring (PTH) .005" .005" .004"
ETCHING
Line Width Tolerance +/- .001" +/- .0005" +/- .0004"
Front to Back Registration Tolerance +/- .002" +/- .001" +/- .0005"
Max Copper Weight (with Solder Mask) 3 ounce
Max Copper Weight (w/o Solder Mask) 5 ounce 7 ounce
Etch Factor (per ounce of base copper) 0.001"
Minimum SMT pitch .020" .015" .012"
Minimum Annular Ring (signal layer) .008" .006" .005"
Minimum Clearance Ring (pwr/grd) .015" .015" .010"
FABRICATION
Minimum Edge Clearance (routing) .015" .010" .008"
Minimum Edge Clearance (scoring) .030" .025" .020"
On Routed Panels we typically add: .500" waste area to all edges
Dimensional Accuracy (routing) +/- .005" +/- .003"
Dimensional Accuracy (scoring) +/- .020" +/- .020"
Minimum Score Thickness +/- .015" +/- .010"
Minimum Size for Routed Slot .020" .020"
DRILLING
Dicing+/- .001
Minimum Hole Size (PTH) .008" .007" .006"
Drilled Hole Location Tolerance +/- .003" +/- .002" +/- .002"
Max Aspect Ratio (Dt : hole dia) 8:1 10:1 12:1
SOLDERMASK / SILKSCREEN
Min Soldermask Annular Ring .003"
Min LPI Feature .004"
Min Line Width (silkscreen) .005"
Min Character Height (silkscreen) .050"
Copper in PTH .001 - .0015"
Tin Lead (solder) 60 -100 micro inches
Electrolytic Nickel 150 - 200 micro inches
Electrolytic Gold 30-50 micro inches
Electrolytic Tin 150 - 200 micro inches
Electroless Tin 40 micro inches
Immersion Silver 5-15 micro inches
Electroless Nickel 118-236 micro inches (per IPC-4552 ENIG spec)
Immersion Gold 1.97 (min) micro inches (per IPC-4552 ENIG spec)
ELECTRICAL TESTING
Seica Flying Probe S20 BBT 4 Independent Probes-2 Sided
Continuity Test
4 Independent Probes - 2 sided
Desired File Formats AutoCAD (DWG or DXF)
Gerber
NC Drill Files
Outside Processes Available:
  • Laser Rout
  • Via Fill

Printed Circuit Board Highlights

General
Prototype
Medium Volume Production
Expedited Deliveries
Industry Focus
Aerospace
Defense / Military
Industrial Electronics
Instrumentation
Medical
Microwave / RF
Telecommunications / IT
Industry Certifications
AS9100 - Aerospace Quality Management Standard
ISO9001 - International Standards Organization
ITAR - International Traffic in Arms Regulations
RoHS - Restriction of Hazardous Substances
PCB Industry Standards:
IPC-6012 - Qualification and Performance Specification for Rigid Printed Boards
IPC-6018 - Microwave End Product Board Inspection and Test
IPC-A-600 - Acceptability of Printed Boards
UL -Underwriters Laboratories