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Custom Manufacturing of Multilayer Mixed Dielectric PCB for the Aerospace/Defense Industry

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Consisting of multiple laminates and differing dielectric constants, this multilayer (displayed right) is a mixed-dielectric printed circuit board which was manufactured for the Aerospace Industry. Beginning with Inventory, all the correct materials were pulled and checked against customer requirements and specifications.

Initially, all innerlayers were drilled, imaged, and etched. The innerlayers then proceeded to Lamination where they were pressed into panels using low Dk bonding films. After lamination and cool-down, the panels moved to drilling where all primary holes were drilled. To prepare the hole walls for Direct Metallization, the panels were processed through Plasma and Sodium etching.

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Multilayer Mixed Dielectric
Multilayer Mixed Dielectric

After DMS, the outerlayers of the panels were imaged, copper plated, solder plated, and etched. Trace widths had to be controlled to +/- .0005" to provide the end product with proper electrical characteristics. A Liquid Photoimageable (LPI) soldermask was applied, followed by a ENIG (Electroless Nickel Immersion Gold) final finish. Using a number of product evaluation techniques, including flying probe testing, we ensured that this PCB met with all client product requirements. The boards were vacuum packaged and shipped to their facility in Northeastern US.

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Multilayer Mixed Dielectric PCB Specifications:

Product Description This Multi-Layer Mixed Dielectric PCB is used within an Aerospace application and contains different laminates and structures.
Capabilities Applied/Processes
Inner layer Fabrication (Image, Etch, and Oxide)
Multilayer Lamination
CNC Drilling
Prep Hole Wall
  • Plasma Etching
  • Sodium Etching
Direct Metallization
  • Conductive Polymer
  • Copper
  • Tin/Lead Plating
LPI Soldermask / Silkscreen
ENIG Plate
  • Electroless Nickel- Immersion Gold
Final Fabrication
  • Vacuum packed
Equipment Used
CNC Driller
Vacuum Lamination Press
Alternative Oxide Line
Plasma Etch / Sodium Etch
Exposure, Developer
CNC Router
Flying Probe Electrical Test
Overall Part Dimensions Length: 3"
Width: 1.5"
Layers: 6
Tightest Tolerances ±.0005" on Etched Features
Material Used Ceramic filled PTFE, Multi-functional FR4
Material Finish Electroless Nickel - Immersion Gold
Estimated Part Weight 20 Grams
In process testing performed Line Width Verification
Full Electrical Test
Cross Section Analysis
Industry for Use Defense/Aerospace
Quantity Manufactured 75
Delivery Location Northeast US
Standards Met IPC-6018 - Microwave End Product Board Inspection and Test
IPC-A-600 - Acceptability of Printed Boards
Product Name Multi-Layer Mixed Dielectric PCB (Printed Circuit Board)

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