Printed Circuit Board Manufacturing
Standard Printed Circuits, Inc. is an independent manufacturer of rigid printed circuit boards up to 24 layers. Our expertise covers a broad range of advanced dielectrics including PTFE, ceramic loaded PTFE, TMM, Polyimide, Polyphenylene oxide, as well as the more common multi-functional FR4s and phenolic resin systems. We stock a wide variety of bonding films from standard epoxy prepregs and other thermoset films to low Dk thermoplastic resins like DuPont’s FEP.
Standard Printed Circuits utilizes several advanced systems to process our products including: Plasma etching, Sodium Etch of PTFE surfaces, Conductive Polymer line for PTH processing, Vacuum lamination, Flying Probe Electrical Tester, as well as a State-of-the-Art Chemcut 8000 Etcher for controlled impedance. In addition, we can provide a wide variety of final finishes including: SMOBC, HASL, as well as our RoHS compliant ‘lead free’ finishes: ENIG, Immersion Silver, Electroless Tin, Lead Free HASL, and Bare Copper with OSP.
| DESCRIPTION | PRODUCTION | PROTOTYPE | EXPERIMENTAL |
|---|---|---|---|
| Minimum Laminate Thickness | .003" | .002" | .0005" |
| Maximum Laminate Thickness | .250" | .250" | .265" |
| Maximum Layer Count | 14 | 24 | 24 |
| Minimum Conductor Width | .005" | .004" | .004" |
| Minimum Spacing | .005" | .005" | .004" |
| Minimum Annular Ring (PTH) | .005" | .005" | .004" |
| HALF OUNCE COPPER | |||
| Minimum Conductor Width | .005" | .005" | .003" |
| Minimum Spacing | .005" | .005" | .004" |
| Minimum Annular Ring (PTH) | .005" | .005" | .004" |
| ETCHING | |||
| Line Width Tolerance | +/- .001" | +/- .0005" | +/- .0004" |
| Front to Back Registration Tolerance | +/- .002" | +/- .001" | +/- .0005" |
| Max Copper Weight (with Solder Mask) | 3 ounce | ||
| Max Copper Weight (w/o Solder Mask) | 5 ounce | 7 ounce | |
| Etch Factor (per ounce of base copper) | 0.001" | ||
| Minimum SMT pitch | .020" | .015" | .012" |
| Minimum Annular Ring (signal layer) | .008" | .006" | .005" |
| Minimum Clearance Ring (pwr/grd) | .015" | .015" | .010" |
| FABRICATION | |||
| Minimum Edge Clearance (routing) | .015" | .010" | .008" |
| Minimum Edge Clearance (scoring) | .030" | .025" | .020" |
| On Routed Panels we typically add: | .500" waste area to all edges | ||
| Dimensional Accuracy (routing) | +/- .005" | +/- .003" | |
| Dimensional Accuracy (scoring) | +/- .020" | +/- .020" | |
| Minimum Score Thickness | +/- .015" | +/- .010" | |
| Minimum Size for Routed Slot | .020" | .020" | |
| DRILLING | |||
| Dicing+/- .001 | |||
| Minimum Hole Size (PTH) | .008" | .007" | .006" |
| Drilled Hole Location Tolerance | +/- .003" | +/- .002" | +/- .002" |
| Max Aspect Ratio (Dt : hole dia) | 8:1 | 10:1 | 12:1 |
| SOLDERMASK / SILKSCREEN | |||
| Min Soldermask Annular Ring | .003" | ||
| Min LPI Feature | .004" | ||
| Min Line Width (silkscreen) | .005" | ||
| Min Character Height (silkscreen) | .050" | ||
| Copper in PTH | .001 - .0015" | ||
| Tin Lead (solder) | 60 -100 micro inches | ||
| Electrolytic Nickel | 150 - 200 micro inches | ||
| Electrolytic Gold | 30-50 micro inches | ||
| Electrolytic Tin | 150 - 200 micro inches | ||
| Electroless Tin | 40 micro inches | ||
| Immersion Silver | 5-15 micro inches | ||
| Electroless Nickel | 118-236 micro inches (per IPC-4552 ENIG spec) | ||
| Immersion Gold | 1.97 (min) micro inches (per IPC-4552 ENIG spec) | ||
| ELECTRICAL TESTING | |||
| Seica Flying Probe S20 BBT | 4 Independent Probes-2 Sided Continuity Test |
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| 4 Independent Probes - 2 sided | |||
| Desired File Formats | AutoCAD (DWG or DXF) Gerber |
NC Drill Files | |
| Outside Processes Available: | |||
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